聚吡咯对Cu(II)的催化还原作用

Catalytic Reduction of Cu(II) by Polypyrrole

以对甲苯磺酸钠为掺杂剂在不锈钢(SS)电极表面恒电位合成聚吡咯(PPy)修饰膜,采用恒电位和动电位对Cu(II)的还原效果进行了研究,并与不锈钢电极进行了对比.结果表明,由于聚吡咯的催化作用,聚吡咯修饰电极对Cu(II)还原效率高于不锈钢电极;聚吡咯膜对析氢有明显的抑制作用,因此电流效率远远高于不锈钢电极,这是采用聚吡咯进行电化学还原的明显优势.通过在不同浓度Cu(II)酸性溶液中的循环伏安行为讨论了聚吡咯对Cu(II)的还原作用机理.

Polypyrrole（PPy） films were synthesized by a potentiostatic method from a para-toluenesulfonic sodium solution on stainless steel（SS）.The effect on Cu（Ⅱ） reduction of the PPy-modified film was investigated through potentiostatic and potentiodynamic conditions and compared with that of SS.A higher removal efficiency was achieved on PPy because of its catalytic effect.The current efficiency obtained with the PPy film is much higher than that of SS because PPy inhibits the effect of hydrogen evolution and this is the greatest advantage for using PPy to remove heavy metals.Cyclic voltammetry of PPy-modified electrodes in acidified Cu（Ⅱ） solutions was conducted and the mechanism of PPy for Cu（Ⅱ） reduction was discussed.