以Au和Au-Cu为衬底的Si/DLC薄膜的机械性能(英文)

Mechanical Properties of Si/DLC Films on Au and Au-Cu Substrates

通过纳米划痕测试技术(nano-scratch)研究了以Au和Au-Cu(xAu=93%,xCu=7%)为衬底,多晶硅Si为基片的类金刚石(DLC)薄膜的机械性能,其中DLC薄膜厚度约为10nm.研究结果表明,Au-Cu衬底对Si/DLC薄膜的结合力比Au衬底对Si/DLC薄膜的结合力要好.紫外(244nm)为激发光源的拉曼光谱测试结果显示在相同薄膜制备条件下Au-Cu衬底比Au衬底含有更多的sp3成分,同时也意味着以Au-Cu为衬底的Si/DLC薄膜具有更高的硬度和密度.通过对研究结果的分析讨论可以得出,由于具有较好的结合力和高硬度,Au-Cu是磁记录磁头保护膜Si/DLC薄膜的更好lead材料.

The mechanical properties of Si/DLC（diamond-like carbon,around 10 nm） films on Au and Au-Cu（xAu= 93%,xCu=7%） substrates were studied by nanoscratch tests.Results show that Au-Cu exhibits better adhesion to Si/DLC than Au does to Si/DLC.Ultraviolet（244 nm） Raman spectra show that DLC films on Au-Cu contain more sp3 character than those on Au using the same batch coating process.This indicates greater hardness and higher density of the films on Au-Cu.The implications of these results on the mechanisms proposed for film formation are discussed.Au-Cu is thus a better candidate for use as a lead material in Si/DLC coatings because of its better adhesion and greater hardness for magnetic recording sliders.