硅片力学性能及热膨胀系数的热稳定性研究

THERMAL STABILITY OF MECHANICAL PROPERTY AND THERMAL EXPAND COEFFICIENT OF SILICONE CHIP

在-100～100℃范围内试验测量并分析了不同温度下硅片力学性能及热膨胀系数的变化规律。结果表明：随温度升高硅片由完全弹性变形转变为弹塑性变形，温度越高，塑性变形出现越早，其比例也随温度升高而增大；当材料表现为完全弹性变形时，弹性模量随温度升高而增加，抗拉强度则随之降低；当材料表现为弹塑性变形时，弹性模量随温度升高而降低，抗拉强度随温度升高而升高，且产生塑性变形所需外加载荷随温度升高而降低；硅片热膨胀系数则随温度升高而增加，较低温度时热膨胀系数增加很快，而较高温度下热膨胀系数逐渐趋于平缓。

In this paper, evolvement of mechanical property and thermal expand coefficient of silicone chip under different temperature were investigated in the temperature range of -100-100℃. The results showed that complete elastic deformation changes into elastic-plastic deformation in silicone chip with increasing temperature. The plastic deformation appears earlier under higher temperature. When the material exhibited complete elasticity, elastic modulus is increasing and tension strength is reducing with increase of temperature. When the material exhibited elastic-plastic, elastic modulus is reducing and tension strength is increasing with increase of temperature and external load that produces plasticity is also reducing. Thermal expand coefficient of silicone chip increased with increase of temperature, its increasing rate is greater at low temperatures, and becomes flat at high temperatures.