陶瓷绝缘子的测试与改进

Testing and Improvement of Insulator

金属墙镶嵌氧化铝陶瓷绝缘子是微波毫米波芯片广泛运用的一种封装外壳形式,而绝缘子则是封装外壳的关键组成部分,它连接了封装外壳内的器件和外部的模块,所以它的特性直接影响所封装器件或模块的微波性能。文章通过对一种现有的镶嵌类封装外壳的陶瓷绝缘子利用电磁场仿真软件HFSS进行微波S参数仿真设计、用普通高温共烧陶瓷(HTCC)工艺加工后,进行测试及改进,减小了陶瓷绝缘子的微波传输损耗和驻波比,从而提高了外壳使用截止频率。

Metal wall mounted microwave alumina ceramic insulator is extensive use of millimeter wave a chipshaped shell-style package, and the insulator is packaging a key component of the shell, which connected the devices in the shell and the module out of the shell; and it features a direct impact on the device or module package microwave performance. In this paper, the existing mosaic of a shell-type ceramic packages for microwave S parameters insulator simulation design by HFSS, HTCC ordinary processing, the testing and improve- ment of the ceramic insulator to reduce the microwave propagation loss and VSWR, so as to enhance the use of cut-off frequency of the shell.