无氰镀铜的实验研究与生产应用进展(一)

Advances in experimental study and production practice of cyanide-free copper plating—Part I

分析了基于硫酸盐光亮酸性镀铜体系的钢铁件浸镀铜工艺工业化应用的不可行性,以及浸镀与电沉积相结合的酸性镀铜工艺的特点。介绍了酸铜光亮剂、钢铁件活化原理、无氰碱铜配位剂等研究的最新进展。指出HEDP无氰碱铜镀液具有化学活化作用,以及预浸能提高镀层结合力。

The unfeasibility of dip plating of copper on iron and steel workpiece from a bright acid copper sulfate bath and the features of acid copper plating process characterized by the combination of dip plating with electrodeposition were analyzed. The latest progress in the studies of acid copper brightener, iron and steel activation principle, and complexing agent for cyanide-free alkaline copper plating were introduced. It is pointed out that cyanide-free HEDP copper plating bath has chemical activation effect and pre-dipping can improve the adhesion of deposit to substrate.