焊膏印刷工艺的控制

Controlling the Process in Stencil Printing

在表面安装工艺中，焊膏印刷是一道关键的工序，焊膏印刷工艺的控制影响着组装板的质量。漏版、焊膏与印刷机是组成焊膏印刷工艺的三项基本内容，三方面相互联系，决定着整个工艺的品质。从焊膏的理化特性、漏版的设计制造以及焊膏印刷机工艺参数的优化设定等方面对焊膏印刷工艺的控制作了初步探讨。

Of all the operations involved in surface mount processes,stencil printing Plays an important part,and the contrilling of solder paste paste deposition has effect on the quality of assemblies.Althoughj solder paste printing includes three basic items_stencil,solder paste and printing machines.They have inherence associated each other and affect the entire process.In this article,all those factors which control the stencil printing process,such as the characteristics of solder paste,designation and manufacture of stencil,the optimization of variables for printer's setting up and other issues are discussed.