星箭解锁装置夹块断裂分析

Fracture Analysis of Clamp Splice of Unlocking Device

星箭解锁装置夹块在进行振动试验时,一个夹块发生断裂。通过断口宏微观观察、金相组织检查、化学成分分析,确定了夹块断裂性质和原因。结果表明:分布在应力集中区的氧化膜缺陷是导致夹块断裂的主要原因;"U"型槽斜面与槽底无明显的圆角过渡,也是导致夹块断裂的一个因素。在此基础上,对氧化膜缺陷的形成机制和预防方法进行了阐述。

One clamp splice fractured during vibration testing carried out for the unlocking devices of satellites and rockets. Based on macro and micro appearance observation, metallurgical structure inspection, and chemical composition analysis, the fracture mechanism and cause were found. The results show that the fracture of the clamp splice was overload fracture. The fracture of the clamp splice was mainly caused by the oxide film defect located at stress concentration zone. There was no obvious round angle between the inclined plane and the bottom of the groove, which was the other factor of the clamp splice fracture. Then the formation mechanism and elimination methods of the oxide film defect were elaborated.