等离子体轰击致聚酰亚胺表面亲水性研究

Hydrophilicity of Polyimide Surface-Modified by Plasma Bombardment

等离子体轰击聚酰亚胺表面会提高挠性印制电路板中溅射铜膜与聚酰亚胺基板的附着力,同时聚酰亚胺表面亲水性随之改变。本文通过改变轰击等离子体种类、轰击电流、轰击时间和轰击气压等条件,研究这些工艺参数与聚酰亚胺表面亲水性的相互关系。在等离子体轰击处理后的聚酰亚胺上磁控溅射镀铜并电镀加厚,利用剥离强度测试仪测量铜膜与聚酰亚胺基板的附着力,并分析亲水性与附着力之间的关系。研究发现,等离子体轰击可以增强聚酰亚胺的亲水性及聚酰亚胺基板与铜膜的附着力,且亲水性越好的样品,溅射镀铜后铜膜与基板的附着力也越好,并得到了等离子体轰击参数与亲水性的关系;研究表明可以把测量亲水性作为聚酰亚胺表面等离子体轰击效果的一种评价方法。

A novel technique was developed to improve the hydrophilicity of polyimide surface and to enhance its interfacial adhesion to Cu film. In the technique, polyimide surfaces were modified by plasma bombardment. The impacts of the surface modification conditions, including type of plasma, bombardment current, time and pressure, on its hydrophilicity were sludied. In addition, the Cu films were deposited on the surface modified polyimide substrate. The results show that plasma surface modification significantly improves its hydrophilicity and its interfacial adhesion. Interesting finding is that the higher the hydrophilicity, the stronger the interfacial adhesion. We suggest that a judicious choiec of plasma surface modification conditions may lead to an optimized hydrophilicity.