球化温度对BGA钎焊球真球度及表面质量的影响

Influence of Spheroidization Temperature on Real Sphericity and Surface Quality of BGA Solder Ball

钎焊球是BGA及μBGA等高密封装技术中凸点制作的关键材料,球化温度是影响钎焊球质量的关键因素之一。本文采用自制切丝重熔法装置,以花生油为球化剂,研究了球化温度对63Sn37Pb钎焊球真球度和表面质量的影响。结果表明:在其他条件相同情况下,随着球化温度升高,钎焊球球化效果及表面质量越好,但球化温度过高(超过300℃),球化剂易产生浓烟,钎焊球易氧化。实验条件下,球化温度以300℃为宜。

Solder ball is the important material of high hencapsulate technology such as BGA（Ball Grid Array） and μBGA, and the spheroidization temperature is one of important factors of the surface quality. The influence of spheroidization temperature on real sphericity and surface quality was studied, using peanut oil as the nodulizer. The results show that the real sphericity and surface quality of the solder ball are better under the higher spheroidization temperature. However, when the spheroidization temperature is too high, the nodulizer emits the smother and the solder balls are oxidized easily. So the spheroidization temperature should be 300 ℃ under the condition of the experiment.