SiC晶须增韧光敏树脂的力学性能影响因素研究

Research on influencing factor of mechanical properties of SiC whisker toughened photosensitive resins

根据光固化成型技术(SL)工艺对光敏树脂的要求和光敏树脂的固化机理,选择匹配的单体三羟甲基丙烷三丙烯酸酯和光引发剂2-异丙基硫杂蒽酮,通过大量的试验合成光敏树脂。针对研制的光敏树脂力学性能不太理想的问题,利用经表面处理后的SiC晶须对树脂体系进行增韧试验,晶须的表面处理工艺和晶须含量(含量均指质量分数)对光固化复合材料力学性能的影响、晶须含量对光固化复合材料固化速度的影响进行分析。实验结果表明:改性后的光敏树脂力学性能有所提高;随着晶须含量的增加,固化速度明显变慢。

According to the demand of stereolithograghy for photosensitive resins and the solidified mechanism of photosensitive resins, the matching monomeroTMPTA, photoiniator-ITX were selected, and the photosensitive resins were synthesized by lots of experiments. As the mechanical properties of the synthesized photosensitive resins were unsatisfied, photosensitive resins were toughened using surface treated SiC whisker, and effect of surface treatment techniques and mass fraction of SiC whisker on mechanical properties of light-cured composite material and effect of SiC whisker＇ mass fraction on curing rate of 1 ight-cured composite material were studied. The result indicates that mechanical properties of modified photosensitive resins increase, and curing rate becomes slow with mass fraction of SiC whisker increasing.