摘要
为了减小电容式加速度计的体积,提高检测精度、扩展应用范围,采用厚膜混合集成工艺,将检测电路和电容式加速度计敏感单元集成于一体。详细介绍了厚膜混合集成工艺的版图设计和制作过程,并介绍了制作工艺中的各道工序。用UP-16封装形式,对厚膜混合集成电容式加速度计进行了封装。经过与原电路比较后可知经厚膜混合集成后,体积大大减小,经封装后通过金属外壳接地,提高抗干扰能力,经测试,其测试精度能提高1-2个数量级。
In order to reduce the volume of capacitive accelerometer , improve detection accuracy, scope of technology application, is used to thick-film integrate hybrid detecting expand the integration circuit and sensitive part of capacitive accelerometer in one unit. The layout design and making process of thick-film hybrid integrated cell is introduced in detail in this paper, as well as each process of production. Finally, UP-16 package is used to package the thick-film hybrid integrated capacitive accelerometer. After comparison with the original circuit, it is obvious that the volume of new accelerometer is reduced greatly. Besides this , the anti-interference ability is increased by grounding of metal case. The test is showed that the measuring accuracy can be increased 1-2 orders of magnitude.
出处
《传感器世界》
2009年第11期20-22,共3页
Sensor World
基金
河南省科技攻关项目基金资助(编号:082102210111)
关键词
电容式加速度计
厚膜混合集成
丝网印刷
再回流焊
金丝键合
capacitive accelerometer
thick-film hybrid integrated
silk screen printing
refluence solder
spun gold bonding