高温氨预处理对单晶硅衬底上镍薄膜显微结构的影响

Effect of thermal ammonia pretreatment on nanostructure of nickel thin films on single crystal silicon substrates

采用K575X高分辨率溅射仪在单晶硅衬底上制备镍纳米催化剂薄膜。研究了高温氨气刻蚀对镍催化剂由连续薄膜转变成纳米颗粒的影响。探讨了预处理时间、温度和催化剂薄膜原始厚度等工艺参数对镍薄膜微结构的影响,得到了镍催化剂薄膜的氨预处理规律,并初步分析了氨气对其形貌变化的影响机理。研究结果表明,获得均匀、细小和高密度过渡镍金属催化剂颗粒的工艺条件是预处理时间、温度和催化剂薄膜原始厚度分别为12min8、00℃和10nm。

Nickel nanometer catalyst thin films were prepared on single crystal silicon substrate using K575X peltier cooled high resolution sputtering coater. The effects of ammonia pretreatment on the catalyst films from continuous film to the nanoparticles were investigated. The nanostructure of the Ni thin films as a function of pretreatment time, temperature and catalyst film original thickness were discussed. The optimum parameters of etching process were obtained, and the action mechanism of ammonia was primarily analyzed. The results indicate that the optimum conditions for the uniform, small and high density transition metal catalyst particles substrates are as follows： etching duration of about 12min, etching temperature of 800℃ and initial film thickness of 10nm.