MEMS的封装技术

The Encapsulation Technology of MEMS

相对于目前MEMS器件或系统的设计与制作技术,落后的封装技术己成为制约MEMS产品进入市场的瓶颈。针对IC封装技术,介绍了MEMS封装技术特点和功能,分析了封装成本的影响因素,并给出了常用MEMS封装的工艺流程和主要封装技术,最后,对MEMS封装的发展趋势做了分析。

Compared with the present MEMS component or the designing and manufacturing technology of the system, the backward encapsulation technology has become the bottleneck to restrict MEMS products to enter the market. In view of the IC encapsulation technology, this article introduces the characteristics and functions of MEMS en- capsulation technology. Then it analyzes the factors influencing encapsulation cost, and presents the technical process of commonly used MEMS encapsulation and the main encapsulation technology. In the end, it gives an.analysis of the developing trend of MEMS encapsulation.