微电子机械系统键合强度检测方法研究进展

Research Advances of the Bonding Strength Measurements in MEMS

把微电子机械系统键合强度检测分为传统分层检测方法、微结构检测方法和非破坏性检测方法,并逐一对这些方法进行细分和详细地描述。传统分层检测方法的难点是结构的夹持,而且不能实现在线监测;非破坏性检测方法检测范围有限,而且检测仪器较为复杂。微结构检测方法最适合于检测微小面积键合强度,该方法又分为微结构微力测试法和微结构在线检测方法两类,微结构微力测试法需要高精度的微力测试仪,而且也不能实现在线检测;微结构在线检测方法只需要一台带有显微镜的探针台,这些都是大部分微机电系统工艺线所具备的,它是一种在线检测方法,直接在晶圆片上进行检测,不需要进行划片,是目前微电子机械系统键合强度检测中最优检测方法。

The bonding strength measurement methods in MEMS are divided into three classes as classical layered measurement methods,microstructure measurement methods and non-destructive measurement methods,and the detailed description of every method is introduced.The structure clamping is difficulty of traditional layered measurement methods,and the methods are unable to achieve online measurement.The measurement is limited in the small range with non-destructive measurement methods,and the measurement instruments are more complex.Microstructure measurement methods are the most suitable for micro-dimension bonding,and the methods are divided into two sorts of micro-force measurement and microstructure online mea-surement.Microstructure micro-force measurement method needs some micro-force measurement devices with high degree of accuracy,and is unable to achieve online measurement too.Microstructure online measurement method only needs a probe station with a microscope,and the majority of processing lines are satisfy the requirements of the probe station,and the measurement is finished on the wafer without scribing,so it is the optimal method for micro-dimension bon-ding strength measurement in MEMS.