摘要
TiB_2熔点高、硬度高、密度低、电阻率低、高温下化学稳定性好,是一种应用潜力巨大的涂层材料。磁控溅射法是一种重要的制备TiB_2涂层的物理气相沉积方法,具有沉积温度低、基体可选择范围大的优点。分析和总结了偏压大小与极性、基体温度和气压等工艺参数对涂层沉积速率、显微结构(包括形貌、结晶度、织构和晶粒尺寸等)、性能(包括硬度、弹性模量、结合强度和摩擦学性能)和残余应力的影响,并概括了目前降低残余应力的途径。
Titanium diboride（TiB2 ） is a potential coating material in industry application with high melting point, high hardness, low density, tow electrical resistance and good chemical stability at high temperature. Magnetron sputtering method,which is applied to deposit TiB2 coating at lower temperature on various substrate, is an important preparation method employing physical vapor deposition principle. The effects of processing parameters on deposition rate,microstructure,performance properties and residual compressive stress are reviewed and various approachs to reduce the residual stress are suggested.
关键词
TIB2涂层
磁控溅射法
性能
残余应力
TiB2 coating, magnetron sputtering method, properties, residual stress
