摘要
铜线具有优良的机械、电、热性能,用其代替金线可以缩小焊接间距、提高芯片频率和可靠性。介绍了引线键合工艺的概念、基本形式和工艺参数;针对铜丝易氧化的特性指出,焊接时必须采用特殊的防氧化工艺,以改善其焊接性能;最后对铜丝键合可靠性及主要失效模式进行了分析。
The copper wire has a good mechanical, electrical and thermal properity. Instead of gold wire,it can be used in wire bonding to shorten the spacing of bonding, and to enhance frequency and reliability of chip. The research on concept of wire bonding process, the basic form and process parameters are reviewed in this paper. Aiming at oxidation characteristics of copper wire, the special anti-oxidation process, which can improve its welding performance must be used in welding. Finally, reliability and some main failure mechanisms of copper wire bonding are analyzed.
基金
天津市自然科学基金资助项目(043603211)
关键词
引线键合
铜丝球焊
IC封装
可靠性测试
wire bonding, copper ball bonding, IC packaging, reliability testing
