高速电镀钯-镍合金工艺

High Speed Palladium-Nickel Alloy Electroplating Process

由于金用作电子连接接触表面镀层,成本高,电镀钯-镍合金已成为最具吸引力的接触材料的替代品。然而,传统氨系电镀钯-镍工艺和新的无氨电镀钯-镍工艺有许多环保特征未能达到最佳。与早期电镀钯-镍合金相比,低氨高速电镀钯-镍合金工艺具有技术性能卓越,物料消耗降低和环境状况改善等优势。

Because the cost is high when gold is used as a contacting surface coating for electronic connection, palladium-nickel alloy has become the most attractive substitute for gold in such application. However, conventional ammonia palladium-nickel and mew non-ammonia plating processes are not very satisfactory in the respect of environmental protection. Compared with the palladium-nickel alloy electroplating process at early stage, the low-ammonia and high speed palladium-nickel alloy plating process can offer outstanding technical performances, lower material consumption and improve environmental conditions.