摘要
研究了一种新的甲基磺酸盐电镀锡工艺,通过单因素和正交实验考察了主盐、添加剂和工艺条件对镀层性能的影响,获得了最佳工艺配方。利用扫描电子显微镜、线性扫描伏安法及其它研究方法对镀液和镀层的性能进行了检测。结果表明:该镀锡液具有良好的稳定性,得到的镀层均匀、细致、半光亮。
A new methylsulphonate tin plating process was researched.The effects of main salts,additives and technological conditions on cladding properties were investigated by single factor and orthogonal experiments,as a result the optimal process formula was obtained.The properties of the coating was tested by scanning electron microscope,linear sweep voltammetry and other methods.The results show that the plating solution has a superior stability,and the cladding is uniform,fine and semi-bright.
出处
《电镀与环保》
CAS
CSCD
北大核心
2009年第6期29-32,共4页
Electroplating & Pollution Control
关键词
甲基磺酸
添加剂
表面形貌
极化
methylsuiphonate
additive
surface morphology
polarization
