摘要
产品可靠性测试的失效分析是半导体失效分析的重要也是极具挑战性的部分。而物性失效分析前的预分析(包括电性失效分析)又是整个产品可靠性失效分析中的关键步骤。充分和合理的预分析是提高物性失效分析成功率的重要保障。本文主要根据不同的产品可靠性测试的失效类型和机理来介绍常用的预分析方法和手段,并通过具体的实例图片来阐述预分析的重要作用。将预分析融合于产品可靠性失效分析中,将取得事半功倍的效果。
The failure analysis ( FA ) on the rejects from product reliability tests is important and challenging in semiconductor FA arena. The pre-FA ( including EFA, the electrical FA ) is the most critical stage in the whole FA procedure. Sufficient and reasonable pre-FA ensures the successful rate of physical FA ( PFA ). This paper introduces how to use different pre-FA methods based on the types and failure mechanisms of different product reliability tests. Real cases are reported to emphasize the importance of pre-FA, whose incorporation in the product FA leads to more effective & successful outcomes.
出处
《中国集成电路》
2009年第12期51-55,共5页
China lntegrated Circuit
关键词
产品可靠性
无损失效分析
电性失效分析
物性失效分析
Product reliability
Nondestructive failure analysis
Electrical failnre analysis
Physical failure analysis