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产品可靠性测试失效的预分析

Pre-Failure Analysis for Product Reliability Test Rejects
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摘要 产品可靠性测试的失效分析是半导体失效分析的重要也是极具挑战性的部分。而物性失效分析前的预分析(包括电性失效分析)又是整个产品可靠性失效分析中的关键步骤。充分和合理的预分析是提高物性失效分析成功率的重要保障。本文主要根据不同的产品可靠性测试的失效类型和机理来介绍常用的预分析方法和手段,并通过具体的实例图片来阐述预分析的重要作用。将预分析融合于产品可靠性失效分析中,将取得事半功倍的效果。 The failure analysis ( FA ) on the rejects from product reliability tests is important and challenging in semiconductor FA arena. The pre-FA ( including EFA, the electrical FA ) is the most critical stage in the whole FA procedure. Sufficient and reasonable pre-FA ensures the successful rate of physical FA ( PFA ). This paper introduces how to use different pre-FA methods based on the types and failure mechanisms of different product reliability tests. Real cases are reported to emphasize the importance of pre-FA, whose incorporation in the product FA leads to more effective & successful outcomes.
机构地区 中芯国际
出处 《中国集成电路》 2009年第12期51-55,共5页 China lntegrated Circuit
关键词 产品可靠性 无损失效分析 电性失效分析 物性失效分析 Product reliability Nondestructive failure analysis Electrical failnre analysis Physical failure analysis
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参考文献3

  • 1Way Kuo, Wei-Ting Kary Chien, Taeho Kim,Reliability, Yield, and Stress Burn-in - A Unified Approach for Microelectronics Systems Manufacturing and Software Development, Kluwar Science, Boston, USA, 1998.
  • 2JESD47F, Stress Test Driven Qualification of Integrated Circuits, 2007.
  • 3T.M. Morre and C.D. Hartfield, "Acoustic Microscopy of IC Packages", Microelectronic Failure Analysis, US, Desk Reference 4^th Edition, 1999.

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