期刊文献+

Tensile and Fatigue Properties of Free-Standing Cu Foils 被引量:1

Tensile and Fatigue Properties of Free-Standing Cu Foils
原文传递
导出
摘要 Tensile and fatigue properties of free-standing as-rolled Cu foils were investigated by means of uniaxial tensile and dynamic bending tests. A special testing system was established to evaluate fatigue behavior of a microscale material subjected to dynamic bending load. The experimental results show that the yield strength increases, but the fracturestrain and fatigue resistance decrease with decreasing foil thickness. Deformation and fatigue damage behavior was characterized. The size effect on tensile and fatigue properties of the Cu foils are evaluated to get further understanding of the mechanical behavior of the micrometer-scale metallic materials. Tensile and fatigue properties of free-standing as-rolled Cu foils were investigated by means of uniaxial tensile and dynamic bending tests. A special testing system was established to evaluate fatigue behavior of a microscale material subjected to dynamic bending load. The experimental results show that the yield strength increases, but the fracturestrain and fatigue resistance decrease with decreasing foil thickness. Deformation and fatigue damage behavior was characterized. The size effect on tensile and fatigue properties of the Cu foils are evaluated to get further understanding of the mechanical behavior of the micrometer-scale metallic materials.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2009年第6期721-726,共6页 材料科学技术(英文版)
基金 supported by the National Natural Science Foundation of China (Nos 50571103 and 50890173) the National Basic Research Program of China (No2004CB619303)
关键词 Cu foils Mechanical properties Size effect Cu foils Mechanical properties Size effect
  • 相关文献

参考文献18

  • 1M. Ohring: Reliability and Failure of Electronic Materials and Devices, Academic Press, Boston, 1998.
  • 2W. Menz, J. Mohr and O. Paul: Microsystem Technology, WILEY-CVC Verlag GmbH, Weinheim, 2001.
  • 3G.P. Zhang, K. Takashima and Y. Higo: Mater. Sci. Eng. A, 2006, 426, 95.
  • 4H.S. Cho, K.J. Hemker, K. Lian and J. Goettert: Proc. IEEE Micro Electro-Mechanical-Systems (MEMS), 2002, 439.
  • 5S.M. Allarneh, J. Lou, F. Kavishe, T. Buchheit and W.O. Soboyejo: Mater. Sci. Eng. A, 2004, 371, 256.
  • 6J. Aktaa, J.Th. Reszat, M. Walter, K. Bade and K.J. Hemker: Scripta Mater., 2005, 52, 1217.
  • 7B.L. Boyce, J.R. Michael and P. G. Kotula: Acta Mater., 2004, 52, 1609.
  • 8D.T. Read: Int. J. Fatigue, 1998, 20, 203.
  • 9S. Maekawa, K. Takashima, M. Shimojo and Y. Higo: Jpn. J. Appl. Phys., 1999, 38, 7194.
  • 10K. Takashima, Y. Higo, S. Sugiura and M. Shimojo: Mater. Trans., 2001, 42, 68.

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部