沉积时间和钴盐含量对化学镀Ni-Co-P合金电磁屏蔽效能的影响

Effect of the Sediment Time and the Content of Co^(2+) on the EMI Shielding Efficiency of Ni-Co-P Plating

为了使PVC材料具备电磁屏蔽性能,利用化学镀工艺在PVC基材表面制备了Ni-Co-P合金镀层。利用网络分析仪测量法对镀层的电磁屏蔽效能进行测试,研究了不同沉积时间和钴盐含量对合金镀层电磁屏蔽性能的影响。结果表明:随着沉积时间的增加,镀层电磁屏蔽效能逐渐增加,当沉积时间超过60min之后,镀层的电磁屏蔽效能增加不再明显;而硫酸钴含量的变化对镀层电磁屏蔽效能的影响不明显,这可能是由于钴比镍难还原,含钴镀层的形成比较缓慢,当沉积时间一定时,改变镀液中硫酸钴的含量对镀层沉积速度影响不大所致。

The Ni-Co-P alloy plating layer was prepared on the surface of activated PVC plastic for electromagnetism interference （EMI） shielding by using electroless plating method. The EMI shielding efficiency was tested by the network analysis measurement. The effects of sediment time and content of Co2＋ on the EMI shielding efficiency of plating layer were studied. The result shows that the EMI shielding efficiency of the layer increases remarkably with the prolonging of the sediment time to 60min, after which the increase of EMI shielding efficiency almost stops. The change of the Co2 ＋ content has a little effect on the EMI shielding efficiency, and the possible reason is that the formation of a layer containing Co is slow because the reduction of Co2＋ is more difficult than that of Ni2＋. Within the settled sediment time of 60min, the changing of the content of Co2＋ has little effect on the sediment rate.