摘要
采用Lennard-Jones和Morse势函数对Cu离子溅射不锈钢进行了溅射过程与饱和溅射剂量的分子动力学模拟。模拟结果表明:在溅射过程中,Cu将铁从其位置替换,或者在其间隙位置存在;表层Fe发生了晶格损伤,以一种无定型态存在;而扩散模型中,材料的表层发生了Cu的富集现象,X射线检测表明,该富集相为Cu3Fe4和Cu4Fe。
The implantation process was simulated through molecular dynamic soft and the model was conducted by Lennard -Jones and Morse potential function. The result showed that during implanting process, Cu took the place of Fe, or existed in a gap location. The surface lattice of Fe was damaged and being in a amorphous condition. While in the diffusion model, enrichment phenomenon of Cu occurred. X- ray showed that phase was Cu3Fe4 and Cu4Fe.
出处
《昆明冶金高等专科学校学报》
CAS
2009年第5期1-4,共4页
Journal of Kunming Metallurgy College
基金
云南省应用基础研究:面上项目(2006E0019Q)
关键词
Cu离子注入
抗菌
不锈钢
分子动力学
Cu ion implantation
antibacterial
stainless steel
molecular dynamic
