摘要
介绍了GaN基512×1元紫外长线列焦平面探测器组件的研制过程,并给出了器件的性能。利用金属有机化学气相沉积(MOCVD)方法生长的多层A1GaN外延材料,通过刻蚀、钝化、欧姆接触电极制备等工艺,制作了256×1的背照射AlGaN紫外探测芯片。并对该芯片进行了I-V特性、响应光谱等测试,得到芯片的暗电流Id为4.22×10^-12A、零压电阻风为1.01×10^10Ω,响应波段为305~365nm,响应率约为0.12A/W。该AlGaN探测芯片与电容反馈互阻抗放大器(CTIA)结构的读出电路互连成为一个256模块,两个256模块经过拼接、封装后制备出512×1元紫外长线列焦平面探测器组件。测量室温(300K)时焦平面组件(实际524元)的响应,平均电压响应率为1.8×10^8V/w,其盲元率为9.0%,响应不均匀性为17.8%,359nm处的平均波段探测率为7×10^10cmHz^1/2W^-1。并对器件性能进行了分析。
The fabrication and characterization of GaN-based 512×1 ultraviolet linear photodetector are reported in this work. AIGaN multilayers are grown in wetel-organic chemical vapor deposition (MOCVD). Material etching, passivation, metal contact and other techniques are used in the manufacture of 256×1 back-illuminated A1GaN detector. The current-voltage (LV) curve shows that current at zero bias is 4.22×10^-12A and resistance is 1.01×10^10Ω. A flat band spectral response is achieved in the 305-365 rim. The detector displays an unbiased responsivity of 0. 12 A/W at 359 nm. This detector is bonded to a readout circuit with capacitive feedback transimpedance amplifier (CTIA) structure. Two modules are put together to form 512 linear ultraviolet focal plane arrays (FPA). The FPA is measured in 300 K and achieved average voltage responsivity 1. 8×10^8 V/W, the blind rate 9.0 % and the response nonuniformities 17.8 %. The measurement of signal and noise led to a detectivity of 7×10^10 cmHz^1/2 W^-1 at 359 nm.
出处
《光学学报》
EI
CAS
CSCD
北大核心
2009年第12期3515-3518,共4页
Acta Optica Sinica
基金
国家自然科学基金(60807037,60708028)
中国科学院知识创新工程青年人才领域关键项目资助课题