摘要
利用扫描电镜原位观察方法研究了ＳｉＣｐ／ＺＡ２２复合材料的断裂过程．结果表明，微裂纹的形核主要在基体中的缺陷及晶界处形成，ＳｉＣ颗粒与基体良好的结合界面及颗粒周围基体的强化，使主裂纹的扩展绕过颗粒进行；并提出了ＳｉＣｐ／ＺＡ２２复合材料的断裂机制．
? The fracture processes of SiCp/ZA22 composites have been in situ observed with a scanning electron microscope. The results show that the voids nucleate mainly at the defects and grain boundray in the matrix. The main crack propagates along the matrix among the particulates and detours over the particulates because of the tight combination at particulates/matrix interface and strengthening of the matrix near the particulates. The micromechanism of fracture in SiCp/ZA22 composites is proposed here.
出处
《大连理工大学学报》
CAS
CSCD
北大核心
1998年第6期729-732,共4页
Journal of Dalian University of Technology
基金
国家自然科学基金
博士后基金
