期刊文献+

微拉伸系统中微弹簧力学传感器的研究 被引量:1

RESEARCH OF MICRO-SPRINGS FORCE SENSOR FOR MICRO-TENSILE SYSTEM
下载PDF
导出
摘要 研究应用于薄膜力学微拉伸测试系统的微弹簧力传感器。在单轴薄膜微拉伸系统的基础上,通过有限元模拟分析,研究以S型弹簧为结构基础的微弹簧力传感器。根据模拟结果,利用高精度线切割和UV-LIGA(Ultraviolet Lithographie GalVanoformung Abformung)技术制备出微弹簧力传感器,并在自制装置上进行标定。标定结果表明,由负胶工艺制备的自由式微弹簧力传感器有良好的线性,而且与Ansys模拟的弹性系数结果一致,为微拉伸测试系统提供良好的条件。 The micro-spring force sensor which is applied to micro-tensile system for measuring mechanical properties of thin films is presented. The coefficient of elasticity of micro-spring force sensor is analyzed by Ansys, and micro-spring force sensor is fabricated by linear cutting and UV-LIGA (Ultraviolet Lithographic GalVanoformung Abformung) technology based on analyzed results. The force sensor is calibrated in the special device. The calibrated results show that the force sensor has good consistency with the Ansys result, and it indicates that the force sensor by SU-8 technology have good linearity with large deformation. So the micro-spring force sensor could assure the accuracy of tensile force in the micro-tensile system.
出处 《机械强度》 CAS CSCD 北大核心 2009年第6期914-918,共5页 Journal of Mechanical Strength
基金 国家高技术研究发展计划(863)资助项目(2006AA4Z326)~~
关键词 力传感器 ANSYS 微弹簧 Force sensor Ansys Micro-spring
  • 相关文献

参考文献10

  • 1Taechung Y, Chang J K. Measurement of mechanical properties for MEMS materials[J]. Meas. Sci. Technol., 1999, 10: 706-716.
  • 2Haque M A, Saif M T A. A review of MEMS-based microscale and nanoscale tensile and bending testing[J]. Exp. Mach., 2003, 43(3): 248-255.
  • 3Shape W N, Bin Y, Edwards R L. A new technique for measuring the mechanical properties of thin films[J]. J. Microelectromech. Syst., 1997, 6(3) : 193-199.
  • 4Ogawa H, Suzuki K, Kaneko S, et al. Tensile testing of microfabricated thin films[Jl. Microsyst. Tech., 1997, 3(4): 117-121.
  • 5Tsuchiya T, Tabata O, Sakata J. Specimen size effeet on tensile strength of surface micromachined polycrystalline silicon thin films[J]. J. Microelectromech. Syst., 1998, 7(1 ) : 106-112.
  • 6Chasiotis I, Knauss W. Mechanical properties of thin polysilicon films by means of probe microscopy[ C]//Proceeding of Materials and Device Characterization in Micromachining. Bellingham, USA: Soeiety of Photo-Optical Instrumentation Engineers, 1998: 66-75.
  • 7陈隆庆,赵明暤,张统一.薄膜的力学测试技术[J].机械强度,2001,23(4):413-429. 被引量:41
  • 8张泰华,杨业敏,赵亚溥,余同希,孙庆平.微型材料的拉伸测试方法研究[J].机械强度,2001,23(4):430-436. 被引量:11
  • 9Mazza E, Danuser G, Dual J. Light optical deformation measurements in microbars with nanometer resolution [ J ]. Microsystems. Tech., 1996, 2 (2) : 123-128.
  • 10Liu R, Li X P, Wang H, et al. A new method for the micro-tensile testing of thin film[C]//The 3rd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Beijing, China: IEEE Nanotechnology Council, 2008: 112-115.

二级参考文献27

  • 1Cheng Y T,Philo Mag Lett,2001年,81卷,9页
  • 2Liu Y,Scripta Mater,2001年,44卷,237页
  • 3Su Y J,Acta Mater,2000年,48卷,4901页
  • 4Zhang T Y,Acta Mater,2000年,48卷,2843页
  • 5Huang Y,J Mater Res,2000年,15卷,1786页
  • 6Zhang Tongyi,J Mater Res,2000年,15卷,1868页
  • 7Zhang T Y,Acta Mater,1999年,47卷,3869页
  • 8Cheng Y T,Int J Solids Struct,1999年,36卷,1231页
  • 9Suresh S,Script Mater,1999年,41卷,951页
  • 10Cheng Y T,Appl Phys Lett,1998年,73卷,614页

共引文献47

同被引文献10

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部