摘要
玻璃浆料是一种常用于MEMS器件封装的密封材料。系统研究了MEMS器件在低温下使用玻璃浆料键合硅和玻璃的过程。与大多数MEMS器件采用的玻璃浆料相比(烧结温度400℃以上),此工艺(烧结温度350℃)在键合完成后所形成的封装结构同样具有较高的剪切强度(封装器件剪切强度大于360 kPa),同时具有较好的气密性(合格率达到93.3%),漏率测试结果符合相关标准。结果表明,在保证MEMS器件封装剪切强度和气密性的同时,降低键合温度条件是可以实现的。
Glass frit is a kind of sealing material for MEMS device. The bonding process of Si and glass for MEMS device at low-temperature with glass frit were studied. Compared to the glass frit for most MEMS devices （sintering temperature is above 400 ℃ ）, the package structure formed after bonding （sintering temperature is 350 ℃ ） by the new process has higher shear strength （ 〉 360 kPa）, and better sealing （yield is up to 93.3% ）. The leak rate fits the relative standard. The results show that both shear strength and leak rate are encouraging. It is proved that the MEMS package can be hermetically sealed at the low temperature of 350 ℃.
出处
《半导体技术》
CAS
CSCD
北大核心
2009年第12期1173-1176,共4页
Semiconductor Technology
基金
江苏省自然科学基金资助项目(BK2009112)
关键词
微机电系统
气密封装
玻璃浆料键合
低温
圆片级封装
MEMS device
hermetic package
glass frit bonding
low temperature package
wafer level package
