产品ESD快速低成本测试方法

Methodology for Prompt and Low Cost ESD Test

静电防护(ESD)测试是半导体集成电路可靠性的重要项目,存在ESD问题会对产品的可靠性造成致命的影响。而由于目前产品的ESD测试,必须经过成品封装后才能进行,这样就无法快速进行产品的ESD认证和评估。介绍了ESD测试中如何利用陶瓷双列直插式封装(ceramic DIP或SB)来快速实现产品的ESD测试。对于一些多管脚芯片产品,举例说明了一种共地连接、分组测试的方法,克服了该封装有管脚数量限制的局限性。该方法简单、低成本、并且可以快速完成。可以极大地减少相对于传统ESD评估或认证的时间和成本,随之也大大缩短了产品的研发认证周期。

ESD （electro static discharge.） test is an important item in IC reliability. It is lethal for a product with potential ESD concern. Currently, since the ESD test cannot be done until the chips are assembled, this brings difficulties on timely ESD qualifications and evaluations. The ESD tests were introduced using a ceramic DIP carrier （called ＂side-braze＂, SB） to realize earlier evaluations. For high pincount products, some cases were illustrated using common ground connection and separating the ESD tests to overcome the limitations on SB available leads. The proposed solution is simple, cost effective, and can be done much quicker. It greatly reduces the time and investment on the traditional ESD qualifications and evaluations leading to a much shortened cycle on product development.