精细线路PCB对AOI检测技术的挑战

The Challenges of AOI Inspection of Fine-Line PCBs

高密度互连基板对精细线路的检查提出了更高的要求,文章论述了AOI在检查精细线路时面临的挑战与问题,对生产过程中精细线路的侦测提供了指引。

Finer line of high density interconnection substrate challenges the traditional AOI inspection technology. In this paper,the author analyzes the problems while AOI inspecting fine line,and gives some advice for inspecting fine line.