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表面活性剂四氢噻唑硫酮的整平作用机理研究 被引量:2

STUDY ON LEVELING MECHANISM OF TETRAHYDROTHIAZOLYL THIONE
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摘要 研究了酸性光亮镀铜添加剂四氢噻唑硫酮的电化学行为,提出了表面络合放电的整平作用机理. Electrochemical action of adding agents in acidic Cu plating bath is studied and a new leveling mechanism is put forward in this paper.
作者 李权
出处 《四川师范大学学报(自然科学版)》 CAS CSCD 1998年第6期684-687,共4页 Journal of Sichuan Normal University(Natural Science)
关键词 四氢噻唑硫酮 电化学 整平作用 表面活性剂 镀铜 Tetrahydrothiazolylthione Electrochmistry Mechanism
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  • 1许家园,杨防祖,谢兆雄,周绍民.酸性镀铜液中Cl^—离子的作用机理研究[J].厦门大学学报(自然科学版),1994,33(5):647-651. 被引量:26
  • 2王庆浩,谢洪波,马学奎.有机中间体对电镀酸性硬铜硬度的影响[J].电镀与环保,2006,26(4):14-18. 被引量:1
  • 3Apperson, R Duane, Clouser, et al. Electrodepositd Copper Foil and Process for Making Same Using Electrolyte Solutions Having Controlled Additions of Chloride Ions and Organic Additives [P]. USP 5403465, 1995-04-04.
  • 4E Chassaing, R Wiart. Epitaxial Growth and Electrode Impadance of Copper Electrodeposits [J]. Electrochimica Acta, 1984,29(5):649-660.
  • 5S Yoon, M Schwartz, K Nobe. Rotating Ring-Disk Electrode Studies of Copper Electrodeposition: Effect of Chloride Ions and Organic Additives [J]. Plating and Surface Finishing, 1994,81(12):65-73.
  • 6M Yokio, S Konishi. Interactions of Cl-and Brighterner Components in Copper Plating from an Acid Sulfate Bath [J]. Metal Finishing, 1983,34(8):434-438.
  • 7N Pradhan, P G Krishna, S C Das. Influence of Chloride Ion on Electrocrystallization of Copper [J]. Plating and Surface Finishing, 1996,83(3):56-63.
  • 8M Grall, J M Couret. Cyclic Voltammetric Determination of Brightener Concentration in Acid Copper Sulfate Plating Baths [J]. Plating and Surface Finishing, 1985,72(1):72-75.
  • 9刘烈炜 郭沨 田炜.酞菁染料及其与氯离子协同作用在酸性镀铜电沉积中的作用 [J].材料保护,2001,35(6):82-84.
  • 10ZHANG W, LU X C, LIU Y H, et al. Synergistic effect of ethylene thiourea and bis-(3-sulfopropyl)-disulfide on acid Cu electrodeposition [J]. Journal of the Electrochemical Society, 2007, 154 (10): D526-D529.

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