摘要
研究了酸性光亮镀铜添加剂四氢噻唑硫酮的电化学行为,提出了表面络合放电的整平作用机理.
Electrochemical action of adding agents in acidic Cu plating bath is studied and a new leveling mechanism is put forward in this paper.
出处
《四川师范大学学报(自然科学版)》
CAS
CSCD
1998年第6期684-687,共4页
Journal of Sichuan Normal University(Natural Science)