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锦纶织物化学镀铜研究 被引量:1

Study on Planting Chemical Copper on Polyamide Fabric
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摘要 对锦纶织物的化学镀工艺进行了研究,详述了粗化、活化、解胶、还原、中和与施镀工序的工艺条件,并对化学镀织物性能进行了测试分析。 Chemical planting process on polyamide fabric was studied. The technological conditions of processes which are coarsening, activation, dispergation, planting the fluid ingredient etc. were analysed and the properties of fabric after being planted were also tested and analysed.
出处 《纺织科技进展》 CAS 2009年第6期35-36,43,共3页 Progress in Textile Science & Technology
关键词 锦纶织物 化学镀 工艺条件 屏蔽效能 polyamide fabrics chemical plantings craft conditions screen performance
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