SrBi_4Ti_4O_(15)陶瓷材料介电和导热性能的研究

Dielectric and thermal conduction properties of SrBi_4Ti_4O_(15) materials

用溶胶-凝胶法制备了SrBi4Ti4O15陶瓷材料,研究了烧结温度、铋含量及掺杂Nd对SrBi4Ti4O15陶瓷结构、热扩散率及介电性能的影响。结果发现,SrBi4Ti4O15陶瓷材料的热扩散率和介电常数随烧结温度的升高而增大,最佳烧结温度为1100℃,铋含量过量达10%时,SrBi4Ti4O15陶瓷的热扩散率和介电常数最大。随着掺杂量Nd的增加,SrBi4Ti4O15陶瓷的热扩散率和介电常数随之增大。

The SrBi4Ti4O15 materials were prepared by sol-gel method. The structure, thermal conductivity and dielectric properties were studied at different sintering temperature, bismuth content and doped Nd. Results show that the properties of thermal conductivity and dielectric increase with sintering temperature rising, The optimum sintering temperature was 1100℃. When bismuth content was excessive 10%, the value of thermal diffusivity and dielectric constant were largest. The thermal conductivity and dielectric increase with Nd doped content increasing.