摘要
简单介绍了嵌入式系统中IEEE802.15.4协议栈物理层、MAC子层的系统结构和设计原理,详细阐述了协议栈构架设计所包含的硬件驱动层、物理层和MAC子层三大模块的设计目标和方法。该协议栈基于HCS08 MCU硬件平台,分别在Freescale公司的MC13192和MC13213的基础上得到实现。
This paper simply introduced the system structure and design principle of physical layer of IEEE 802.15.4 protocol stack and MAC sub-layer in embedded system,and detailedly described the design goals and methods of the protocol stack, which includes three modules：hardware driver layer,physical layer and MAC sub-layer. The IEEE802.15.4 protocol stack is based on HCS08 MCU platform,and has been implemented on the basis of MC13192 and MC13213 from Freescale.
出处
《计算机应用与软件》
CSCD
2009年第12期73-74,107,共3页
Computer Applications and Software
基金
上海市科委重大科技攻关项目(05dz15004)
