摘要
低介质损耗是电子装备高频化对复合介质板提出的关键需求之一。陶瓷粉填充聚四氟乙烯复合介质板介质损耗性能的影响因素较多,其控制技术是该类型复合介质板国产化研究工作的关键技术之一。结合研究的工作体会,对影响聚四氟乙烯复合介质板介质损耗性能的因素进行了分析,对控制措施进行了研究讨论。
Low dissipation factor is one of key performance requirements to microwave laminates. In the development process of ceramic powder filled PTFE laminates, it＇s been found that dissipation factor performance is affected by many factors, and its control technology is one of key technologies for study. In this paper, the influence factors are analyzed, and the control methods are discussed.
出处
《电子机械工程》
2009年第6期28-30,61,共4页
Electro-Mechanical Engineering
