摘要
以硝酸-磺酸型退锡剂为基础配方,研制了一种脱除废旧电路板表面残留焊锡的剥离液。该剥离液以硝酸为氧化剂,氨基磺酸为稳定剂,苯并三氮唑为铜的缓蚀剂。实验结果表明:剥离液的最佳配比为硝酸浓度3 mol/L,氨基磺酸浓度0.4 mol/L,苯并三氮唑浓度0.08 mol/L;每升剥离液可处理3.5kg废旧电路板,处理后电路板中的铅离子含量降至100 mg/kg以下。该剥离液处理后的电路板表面的铜箔保持完好,基本没有被剥离液浸蚀。
A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid- sulfonic acid type tin stripper. The experimental results show that： The optimum compositions are as follows： nitric acid concentration 3 mol/L, sulfamic acid concentration 0.4 mol/L, benzotriazole concentration 0.08 mol/L; 1 L stripper can be used to treat 3.5 kg waste printed circuit boards, and the content of lead ions on the treated waste printed circuit boards will decrease to below 100 mg/kg. The copper foil on the surface of the treated waste printed circuit boards is undamaged and essentially not corroded.
出处
《化工环保》
CAS
CSCD
北大核心
2009年第6期549-553,共5页
Environmental Protection of Chemical Industry
基金
广东省科技计划项目(2006A36703001)
关键词
铅
焊锡
废旧电路板
剥离液
硝酸
氨基磺酸
苯并三氮唑
lead
solder
waste printed circuit board
stripper
nitric acid
sulfamic acid
benzotriazole
