摘要
The reliability of microsystems is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show how interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.
The reliability of microsystems is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show how interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.
基金
supported by the German Research Foundation (DFG) under grants OS111/22 and PA792/4
