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GaN/metal/Si heterostructure fabricated by metal bonding and laser lift-off 被引量:1

GaN/metal/Si heterostructure fabricated by metal bonding and laser lift-off
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摘要 A process methodology has been adopted to transfer GaN thin films grown on sapphire substrates to Si substrates using metal bonding and laser lift-off techniques. After bonding, a single KrF (248 nm) excimer laser pulse was directed through the transparent sapphire substrates followed by low-temperature heat treatment to remove the substrates. The influence of bonding temperature and energy density of the excimer laser on the structure and optical properties of GaN films were investigated systemically. Atomic force microscopy, X-ray diffraction and photoluminescence measurements showed that (1) the quality of the GaN film was higher at a lower bonding temperature and lower energy density; (2) the threshold of the energy density of the excimer laser lift-off GaN was 300 mJ/cm^2. The root-mean-square roughness of the transferred GaN surface was about 50 nm at a bonding temperature of 400 ℃. A process methodology has been adopted to transfer GaN thin films grown on sapphire substrates to Si substrates using metal bonding and laser lift-off techniques. After bonding, a single KrF (248 nm) excimer laser pulse was directed through the transparent sapphire substrates followed by low-temperature heat treatment to remove the substrates. The influence of bonding temperature and energy density of the excimer laser on the structure and optical properties of GaN films were investigated systemically. Atomic force microscopy, X-ray diffraction and photoluminescence measurements showed that (1) the quality of the GaN film was higher at a lower bonding temperature and lower energy density; (2) the threshold of the energy density of the excimer laser lift-off GaN was 300 mJ/cm^2. The root-mean-square roughness of the transferred GaN surface was about 50 nm at a bonding temperature of 400 ℃.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第12期5-8,共4页 半导体学报(英文版)
基金 supported by the National Natural Science Foundation of China(Nos.50672079,60676027,60837001,60776007) the State Key Development Program for Basic Research of China(No.2007CB613404) the Natural Science Foundation of Fujian Province (No.2008J 0221) the Science and Technology Program of the Educational Office of Fujian Province(No.JB08215)
关键词 GaN films SILICON metal bonding laser lift-off atomic force microscopy X-ray diffraction GaN films silicon metal bonding laser lift-off atomic force microscopy X-ray diffraction
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