摘要
以3,3′-二氨基-4,4′-二羟基联苯(DADHBP)、2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPOPP)、3,3′,4,4′-四羧基二苯醚二酐(ODPA)为主原料合成了含酚羟基的聚酰亚胺树脂(HPI);以HPI为耐高温增韧剂,与N,N,N′,N′-四缩水甘油基-4,4′-二氨基二苯甲烷(TGDDM)、固化剂等配制了综合性能优异的耐高温单组分环氧胶粘剂。
Polyimide resin （HPI） dihydroxybiphenyl（DADHBP）,2,2-bis- [4- （4 dianhydride（ODPA） as the main raw materials properties was also prepared from N, N, N＇ , resistant toughener and curing agent. containing phenolic hydroxyl groups was synthesized with 3,3＇ -diamino-4,4＇ -aminophenoxy）phenyl]propane（BAPOPP） and 3,3＇ ,4,4＇ -tetracarboxy-diphenyl ether Meanwhile, the epoxy adhesive with high temperature N＇ -tetraglycidyl 4, 4＇ - diaminodiphenyl methane resistance and excellent comprehensive （TGDDM）, HPI as a high temperature
出处
《粘接》
CAS
2009年第12期34-37,共4页
Adhesion
