保温时间对20钢管道瞬时液相扩散连接的影响

Effect of Holding Time on TLP Bonding of 20 Steel Pipes

在开放式管道瞬时液相扩散焊机上进行20钢管的TLP连接,采用氩气保护,连接温度1180℃、连接压力4MPa,中间层材料选用非晶箔BNi2,通过改变保温时间,研究其接头显微组织的变化及降熔元素的扩散情况。结果表明,当保温时间为2和2.5min时,降熔元素Ni、Cr扩散不充分;当保温时间增大到3min时,中间层中Ni、Cr扩散充分,达到比较理想状态,从而获得性能良好的连接接头。

When welding temperature was 1180℃ and pressure was 4 MPa, TLP bonding was carried out using BNi2 as insert layer in an argon atmosphere. The microstructure change and the melting point depressant（MPD） elements diffusion of TLP joints were studied by changing the holding time. The MPD elements diffusion is insufficient when the holding time is 2 min and 2.5min; when the holding time increases to 3 min, the MPD elements has an absolute diffusion, at last a perfect bonding joint is achiend.