期刊文献+

参数化方法在微机械谐振器设计中的应用

Parameterization Design of the Duble-ended Tuning Fork Micro-resinators
下载PDF
导出
摘要 从理论上分析了微机械音叉谐振器的机械力学特性,给出了活动梳齿的工作模态频率解析解,提供谐振器结构设计的依据。利用基于MAST语言实现的MEMS宏模块建立微谐振器系统级通用参数化仿真模型,为验证外围电路提供了基础。事例仿真结果与理论模态分析相一致,验证了模型的有效性。通过减少梁固接端弹性系数、合理安排激励电极能抑制一阶模态扰动。工作模态谐振频率对结构参数的敏感性分析为优化谐振器性能提供基础,使工作模态远离其它高阶模态。敏感性仿真表明在横向振动微谐振器中,工作模态谐振频率随梁长的增加而减小;随梁宽的增加而增大;结构层厚度对横向振动频率没有影响;梳齿部分所有参数的变化造成频率的相反变化。 According to the description of the dynamic of the double-ended tuning fork micro-resonators,the system level universal parameter model is built.The model is a micro model consisting of some sub-blocks based on MAST langue.It can verify the ability of the peripheral circuit and decrease computational cost obviously.The error between analytic result and simulation is acceptable(〈1%).Appropriate parameter value is chosen based on mode analysis and structure sensitivity analysis so that the work resonant frequency can far from the higher order resonant frequency. Making use of the decreasing spring of the joint beam,symmetry electrode can restrain the lower order perturbation.It is discovered that the work resonant frequency lessens slightly as the length of the DETF beam increasing,but the opposite with the variation of its width and all parameters of the comb.The height of the DETF beam is unrelated to the work resonant frequency.
出处 《现代科学仪器》 2009年第5期38-42,共5页 Modern Scientific Instruments
基金 国防预研项目
关键词 双端固定音叉 谐振器 参数模型 谐振频率 Double-ended tuning fork Micro-resonators Parameter model Resonant frequency
  • 相关文献

参考文献8

二级参考文献13

  • 1徐炎冰,范真,丁建宁,李长生,凌智勇.MEMS模拟仿真研究和发展现状[J].现代制造工程,2004(12):116-118. 被引量:3
  • 2戴向国.Pro/Engineer使用与实例精解[M].北京:清华大学出版社,2000..
  • 3胡永华.挠性陀螺仪性能稳定性及其内部温度场的计算机辅助分析[M].北京:东南大学,2000..
  • 4李明.硅微惯性敏感器设计分析与数值模拟研究[M].南京:东南大学,2000..
  • 5JUNEAU T, PISANO A P, SMITH J H. Dual axis operation of a micromachined rate gyroscope [A] . Proceedings of the 1997 International Conference on Solid-state Sensors and Actuators [C] . Chicago, 1997. 883-886.
  • 6PUTTY M, NAJAFI K. A micromechined vibrating ring gyroscope [A].Proceedings of the Solid-state Sensor and Actuator Workshop[C].Hilton Head Island,SC, USA, 1994. 213-220.
  • 7Welham Christopher J, Greenwood J, Bertioli Michael M. A High Accuracy Resonant Pressure Sensor by Fusion Bonding and Trench Etching.Sensors and Actuators, 1999,76(1) : 298-304.
  • 8Aikele M,Bauer K,Ficker W,et al. Resonant Accelerometer with Self--test. Sensors and Actuators, 2000,92 (8) : 161 - 167.
  • 9Beeby Steve P,Ensell Graham, Baker Brian R, et al, Micromachined Silicon Resonant Strain Gauges Fabricated Using SOI Wafer Technology. Journal of Microelectromechanical Systems, 2000,9(1) :104-110.
  • 10Roessig Trey A ,Howe Roger T ,Pisano Albert P,et al. Surface -- micromachined Resonant Accelerometer. 1997 International Conference on Solid State Sensors and Actuators ,Chicago, 1997.

共引文献33

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部