摘要
MEMS高温压力传感器随着新型半导体材料和加工工艺的不断深入研究而迅速发展,近年来这一研究方向涌现出不少研究成果。对国内外具有主导影响的多晶硅、SOI、SOS、金刚石薄膜、SiC、电容式、声表面波、光纤式等几类耐高温压力传感器的研究进展、技术关键及应用情况等做回顾论述,并针对各自的主要优缺点进行对比分析和讨论,最后展望了高温压力传感器的发展趋势。
MEMS high-temperature pressure sensors has a rapid development and appeared lots of research achievements with the deep exploitation of novel semiconductor materials and processing techniques in recent years.The recent progress,key technologies and applications of several dominant high-temperature pressure sensors at home and abroad is reviewed,including poly-Si,SOI,SOS,diamond film,SiC,capacitance,surface acoustic wave,optic-fiber high-temperature pressure sensors,and the advantages and drawbacks upon them is analyzed,lastly the future development of high-temperature pressure sensor is presented.
出处
《仪表技术与传感器》
CSCD
北大核心
2009年第11期4-6,16,共4页
Instrument Technique and Sensor
关键词
高温
压力传感器
多晶硅
碳化硅
金刚石薄膜
声表面波光纤
high-temperature pressure sensor poly-silicon silicon carbon diamond film surface acoustic wave optic-fiber
