MEMS封装中阳极键合技术的影响因素研究和设计因素分析

Influence Factors Research and Design Factors Analysis on Anode linkage Technology in MEMS Packaging

结合MEMS气密性封装的需要,以玻璃与硅晶片阳极键合为例,给出阳极键合的封装工艺,从键合机理的角度研究了玻璃与硅阳极键合的影响因素,并就玻璃与硅阳极键合的设计因素做了分析,得到直径为100mm的Pyrex7740玻璃晶片和硅晶片在键合温度为500℃时,硅晶片的径向应力σrr=134.29MPa;键合后晶片的径向膨胀μ=0.1274mm。

In this article, the packaging process of anode linkage was given through an example of anode linkage process between glass and silicon, according to the requirements of MEMS gas tightness packaging. And the influence factors on the anode linkage between glass and silicon were studied from the point of linkage principle, meanwhile the design factors were analyzed. The results show that the Pyrex7740 glasses chip with the diameter of 100mm links up with the silicon chip at the temperature of 500℃, the radial stress of silicon chip that called σrr is 134.29MPa. After linkage, the radial direction inflation of the chip that called μr is 0. 1274mm