摘要
芯片固晶过程是影响功率型LED封装热阻的重要方面。分析了银胶、共晶合金等不同导热率的固晶材料产生的固晶热阻的大小,并基于正向电压测结温法首次提出了一种测量LED固晶热阻的方法,得到了很好的测量结果,能有效分析封装结构中各部分引入的热阻的大小。
The LED chip bonding is an essential technology to reduce the thermal resistance of LED. Thermal performance of bonding materials such as Ag-epoxy resin was analyzed using heat transfer tools. For the sake of assessing the bonding technology, a method of measuring the thermal resistance induced by bonding process was proposed for the first time based on the forward working voltage method. It is shown that the theoretical simulation results agreed well with the measured results.
出处
《半导体光电》
CAS
CSCD
北大核心
2009年第6期831-834,共4页
Semiconductor Optoelectronics
基金
国家自然科学基金项目(60536020
60390074)
国家"973"计划项目(2006CB302801
2006CB302804
2006CB302806
2006CB921106)
国家"863"计划项目(2006AA03A105)
北京市自然科学基金重点项目(09D0220)
深圳市产学研和公共科技专项资助项目(SY200806300244A)
关键词
大功率LED
结温
固晶热阻
power LED
junction temperature
thermal resistance of bonding