摘要
论述了白光发光二极管(LED)在封装和应用中存在的主要模式和失效机理,并介绍了若干失效分析实例,提出了可靠性保证措施,对于进一步完善白光LED封装技术、提高其寿命和可靠性提供参考。
Discussed are the main failure modes and mechanisms of white LEDs during the processes of package and applications. Several cases for analyzing the failures are introduced. Finally, some reliability assurance measures are suggested to improve the lifetime and reliability of white LEDs, which are helpful for further improvement of the packaging technology.
出处
《半导体光电》
CAS
CSCD
北大核心
2009年第6期857-859,882,共4页
Semiconductor Optoelectronics
