镁合金手机外壳的半固态压铸成形模拟及工艺参数优化研究

Study on the semi-solid die-casting forming process simulation and related technological parameters optimization of magnesium alloy mobile phone

对镁合金手机外壳的半固态压铸成形过程进行了数值模拟,预测了可能产生缩孔、缩松等缺陷产生的部位,分析了其形成原因.根据模拟结果对溢流槽等工艺参数进行了改进,优化了工艺参数.改进的工艺实现了顺序凝固,消除了缩孔、缩松缺陷,保证了压铸件质量.

The semi - solid die - casting processes of magnesium alloy mobile phone are simulated. The possible appearance locations of the shrinkage void and porosity are predicted, and the defects mechanism is analyzed. According to the simulation results, the technological parameters, such as the shape and size of the overflow well, are improved. The improved technologies can achieve the solidifying sequentially, avoid the shrinkage void and porosity, which ensure the casting quality.