铜系电子浆料的制备及其稳定性研究

Preparation and Stability Study of Copper Based Electrical Conductive Paste

以低温固化类电子浆料作为研究对象,研究了在表面镀银后的铜粉,再包覆一层有机保护膜的抗氧化效果,通过SEM、XRD、测量电阻方法及加速老化实验等手段对其进行了表征和分析,实验结果表明,制备得到的电子浆料在经过1 000 h室温放置、200 h 100℃下及48 h 120℃,80%湿度的加速失效实验后,仍具有较好稳定性及导电性质。

A special organic film was coated on the surface of the silver-plated copper powder in electrical conductive paste to anti-oxidize them and the anti-oxidize capacities of products were tested though SEM, XRD, electric conductivity test and accelerated aging test, which the anti-oxidize capacities of products were tested though 1 000 hours test at room temperature,200 hours oxidization at 100 ℃ and 48 hours oxidization at 120 ℃, humidity level of 80% , the characteristics of electrical conductive paste can meet the applied demand. The results showed that the electrical conductive paste with the anti-oxygenation of micro Cu-Ag bimetallic powder with organic-film had the optimal anti-oxidize capacity.