无铅软钎料的研究

STUDY ON LEAD-FREE SOLDER

为了适应未来电子工业对无毒、无铅钎料的要求 ,本文以 Sn- Sb二元合金系为基础 ,开发出一种新的无毒、无铅系列软钎料 .通过试验 ,筛选出 Sn- 4～ 5Sb- 15～ 2 5Bi- 2～ 5Ag合金系列 ,通过加入 0 .1%～ 0 .0 1% In,0 .8%～ 0 .1% Cu和 0 .1%～ 0 .0 1% Ni等微量元素 ,达到改善合金的润湿性及抗蠕变性能的目的 .

To meetthe future demand for Pb- free,non- toxic solders used in the elec- tronic industry,the possibility of developing a new Pb- free,non- toxic solder alloy system is discussed in the paper.After tests,the Sn- 4～ 5 Sb- 1 5～ 2 5 Bi- 2～ 5 Ag alloy system has been selected out. Its wettability and creep resistance can be greatly improved by adding some trace elements such as In0 .1 %～ 0 .0 1 % ,Cu0 .8%～ 0 .1 % or Ni0 .1 %～ 0 .0 1 % .