摘要
汽车电子技术不断发展,越来越多的新器件、新封装应用在汽车中,这对汽车用功率半导体器件与封装提出很大挑战。文章介绍了不同种类功率半导体器件的特点,具体分析了当前主要的汽车用功率器件的分类、结构、封装与可靠性,并给出这一领域的发展现状。期望通过本综述能为发展国内汽车用功率半导体器件提供更广阔的视野。
With automotive electronic technologies evolving,many new devises and new packginges are used for automotive,It is a great challenge to the power semiconductor devise and packaging advances target automotive applications.This paper introduces basic characters of several kinds of power semiconducter devises, and illustrates the classification,structures,packages and reliabilities of current power semiconducto devises for automotive application in details.And recent development on this area is presented.This paper provides valuable a wide field of vision for the realization of power semiconducto devise in automotive applications.
出处
《电子与封装》
2009年第12期5-10,共6页
Electronics & Packaging
关键词
功率器件
汽车封装
功率密度
可靠性
power device
package for automotive
power density
reliability
