SoC软硬件协同设计方法和技术简析

Brief Analysis of Hardware and Software Co-design Methods in SoC System

集成电路制造技术的迅速发展已经可以把一个完整的电子系统集成到一个芯片上,即所谓的系统级芯片(Systemonachip,简称SoC)。随着其规模的不断增大,如何缩短开发时间、提高开发效率,是当今SoC设计领域中关注的问题之一。传统的设计方法是将硬件和软件分开来设计,在硬件设计完成并生产出样片后才能调试。软硬件协同设计则是代表系统的软件和硬件部分的协作开发过程。对比传统方法,设计工程师能够在设计早期进行调试,可以较早地进行软硬件的整合。软硬件协同设计是一种正在发展中的设计方法,文章讨论了其发展的背景过程以及一般的设计方法和所需注意的事项。

Integrate Circuit （IC） producing technique could settle a whole electric system on one chip which called System on a chip （SoC）. With the continuous increase in its size, how to shorten development time and improve development efficiency is one of the concerns of SoC design. The traditional design in software and hardware is separated, only after hardware design is finished, testing procedure can be executed. The method of software and hardware co-design is totally different from the former that means software and hardware design is developing in the same time. Compared with the traditional methods, designer could debug and integrate hardware and software in an early stage. The co-design is one of the latest methods in SoC techniques which is flourishing rapidly. In this paper, we discuss its background and developing process, after that the general way of a co-design and some vital notes are expounded.