摘要
ASIC芯片物理版图设计的一个重要问题是选用几层金属层。以一款SMIC0.18μmDVBC芯片(BTV2040S03)为例,选用三种不同金属层工艺进行对比。首先设计出三种不同金属层的版图,分析电源电势分布判断其合理性;之后进行布线拥塞率的对比,以分析不同金属层工艺对布线的影响;最后通过最终布线的时序验证和最终流片结果来证实选用金属层设计的可行性。通过上述方法研究集成电路物理设计中,如何选择所使用工艺的金属层数,以达到最大限度节约芯片成本、减小芯片面积和满足布线及时序的目的。
One of the important problems of ASIC chip physical design is how many metal layers to be chosen. Three different metal layer technologies were compared based on the design of SMIC 18μm technology of digital video broadcasting cable chip. The layouts of three different metal layers were designed and the IR drop was analyzed to estimate the design rationality. Then the routing congestions were compared in order to analyze the effects on routing. According to the timing of routed layout and the final result of chip, the feasibility of the design was proved. This method can be used to research the choosing of the numbers of metal layer in order to save the costing, reduce the area and meet the routing and timing.
出处
《半导体技术》
CAS
CSCD
北大核心
2010年第1期27-30,共4页
Semiconductor Technology
