纯铜动态再结晶的三维元胞自动机模拟

Modeling for dynamic recrystallization of pure copper with 3-dimensional cellular automaton method

用三维元胞自动机法(CA法)模拟纯铜在400℃以0.0005s-1的应变率发生动态再结晶(DRX)的过程。给出了母相和再结晶晶粒的平均位错密度随着应变量的变化规律;根据平均位错密度的变化研究了纯铜动态再结晶中形核、长大、动态回复和加工硬化等过程。模拟了纯铜动态再结晶过程中的应力-应变曲线及平均晶粒尺寸的变化规律,模拟结果与文献中的试验结果吻合较好。

A modeling of 3-dimensional cellular automaton（CA） method was developed to simulate the dynamic recrystallization（DRX） of pure copper at 400℃ with constant strain rate 0.0005s^（-1）.Mean dislocation density was used to describe the process of nucleation,growth,work harding and dynamic recovery during dynamic recrystallization.The flow stress was calculated by the mean dislocation.Stress-strain curves and changes of the average grain size during DRX of pure copper were simulated.Simulated results agree well with the experimental result in literature.